SIGNAL INTEGRITY & POWER INTEGRITY PAPERS

Co-Simulation of IC, Package and PCB Power Delivery Networks in Ultra-Low Voltage Power Rail Designs - ECTC 2007

Voltage Regulator Module Noise Analysis for High-Volume Server Applications - EPEP 2005

Frequency Expansion Technique Based on Iterative Solver and Lumped Matrices - EPEP 2005

Chip-Package Co-Design of Highly Linear 3G-CDMA Upconverter Modules - 55th ECTC 2005

Extending the Utility of PakSi-E Models into the Gigabit Range

Accurate Analysis of Multi-Layered Signal and Power Distributions using the Fringe RLGC Models - EPEP 2004

Signal Integrity Modeling and Simulation Tools - DesignCon 2004

THERMAL / MECHANICAL PAPERS

FlipChip BGA Bump & Board Level Reliability: Power & Thermal Cycling Compared - IMAPS June 2005

Development and Application of Lead-Free Solder Joint Fatigue Model for CSP - EMAP 2004

Design Analysis of TFBGA with Customized Solder Joint Fatigue Model - EMAP 2003

Second- Level Reliability for Pb-free Devices - SAC 2003

Comparison of Package Thermal Resistance using Simulation and Measurement for Two-Layer and Four-Layer PBGA Substrate Designs - EMAP 2002

Board Level Solder Joint Reliability Modeling of TFBGA Package - ICEP 2002

Solder Joint Reliability of Substrate Bumping with Standoffs for Flip Chip Interconnections - IMECE 2002

Thermal Analysis of Stacked Die on FBGA Package - APACK 2001

Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer Aided Engineering Tools - Journal of Electronics Manufacturing (Vol. 7, No. 4; Dec. 1997)