Optimal’s PakSi-E is a quasi-static extraction and analysis solution that allows engineers to perform 3D signal integrity analysis, power integrity analysis and simultaneous switching noise (SSN) analysis. Uniquely, PakSi-E has the ability to quickly and accurately analyze the entire package, SiP or mini-PCB.

Optimal’s gigahertz signal and power integrity solution, GH SPI Suite combines the full capabilities of PakSi-E with the advanced DC and AC analysis capabilities of PowerGrid. PowerGrid adds advanced DC analysis capabilities such as voltage contour mapping, current hotspot highlighting and comprehensive AC analysis. Optimal’s common user interface, integrations and utilities make it extremely easy to use the tools together in a seamless design flow.

Optimal’s O-Wave is a full-wave 3D EM analysis solution that allows engineers to perform extremely accurate signal integrity analysis with extremely high performance, capacity and accuracy. This allows engineers to analyze larger structures with fast turnaround time. O-Wave is typically 2-3X faster than competitive solutions. O-Wave has the ability to create fully-coupled ground bounce and SSN models.

Optimal’s multi-gigahertz hertz signal integrity solution, MGH SI Suite includes both PakSi-E and O-Wave. This suite allows engineer’s to use PakSi-E for fast, quasi-static extraction and analysis of the entire structure and O-Wave for deeper analysis of higher frequency signals. Optimal’s common user interface, integrations and utilities make it extremely easy to use the tools together in a seamless design flow.

Optimal’s PakSi-E is a quasi-static extraction and analysis solution that allows engineers to perform 3D signal integrity analysis, power integrity analysis and simultaneous switching noise (SSN) analysis. Uniquely, PakSi-E has the ability to quickly and accurately analyze the entire package, SiP or mini-PCB.

Optimal’s PowerGrid adds advanced DC analysis capabilities such as voltage contour mapping and current hotspot highlighting. PowerGrid is a fast and accurate power integrity solution that is able to perform DC and AC analysis in a single tool. It allows engineers to perform IR drop and ground bounce analysis and is ideal for rapid design iterations on the layouts of signal traces and power distribution networks. PowerGrid’s unique 2.5D model-based, finite element method (FEM) algorithm provides performance that is typically 100X faster than traditional 3D full-wave methods and accuracy that is comparable. PowerGrid’s capacity advantage allows for analysis of large packages, SiPs and PCBs that other analysis tools can’t handle.

Optimal’s gigahertz signal and power integrity solution, GH SPI Suite combines the full capabilities of PakSi-E with the advanced DC and AC analysis capabilities of PowerGrid. PowerGrid DC adds advanced DC analysis capabilities such as voltage contour mapping, current hotspot highlighting and comprehensive AC analysis. Optimal’s common user interface, integrations and utilities make it extremely easy to use the tools together in a seamless design flow.

Optimal’s PowerGrid is a fast and accurate power integrity solution that is able to perform DC and AC analysis in a single tool. It allows engineers to perform IR drop and ground bounce analysis and is ideal for rapid design iterations on the layouts of signal traces and power distribution networks. PowerGrid’s unique 2.5D model-based, finite element method (FEM) algorithm provides performance that is typically 100X faster than traditional 3D full-wave methods and accuracy that is comparable. PowerGrid’s capacity advantage allows for analysis of large packages, SiPs and PCBs that other analysis tools can’t handle.

Optimal’s PakSi-E is a quasi-static extraction and analysis solution that allows engineers to perform 3D signal integrity analysis, power integrity analysis and simultaneous switching noise (SSN) analysis. Uniquely, PakSi-E has the ability to quickly and accurately analyze the entire package, SiP or mini-PCB.

Optimal’s PowerGrid is a fast and accurate power integrity solution that is able to perform DC and AC analysis in a single tool. It allows engineers to perform IR drop and ground bounce analysis and is ideal for rapid design iterations on the layouts of signal traces and power distribution networks. PowerGrid’s unique 2.5D model-based, finite element method (FEM) algorithm provides performance that is typically 100X faster than traditional 3D full-wave methods and accuracy that is comparable. PowerGrid’s capacity advantage allows for analysis of large packages, SiPs and PCBs that other analysis tools can’t handle.

Optimal’s gigahertz signal and power integrity solution, GH SPI Suite combines the full capabilities of PakSi-E with the advanced DC and AC analysis capabilities of PowerGrid. PowerGrid DC adds advanced DC analysis capabilities such as voltage contour mapping, current hotspot highlighting and comprehensive AC analysis. Optimal’s common user interface, integrations and utilities make it extremely easy to use the tools together in a seamless design flow for simultaneous switching noise of designs up to 3GHz.

Optimal’s multi-gigahertz signal, power and SSN analysis solution, MGH SPI Suite includes PakSi-E for SSN analysis of designs up to 3 GHz, and integration of O-Wave and PowerGrid to deliver SSN analysis for high frequency signals.

Optimal’s PakSi-E is a quasi-static extraction and analysis solution that allows engineers to perform 3D signal integrity analysis, power integrity analysis and simultaneous switching noise (SSN) analysis. Uniquely, PakSi-E has the ability to quickly and accurately analyze the entire package, SiP or mini-PCB.

Optimal’s gigahertz signal and power integrity solution, GH SPI Suite combines the full capabilities of PakSi-E with the advanced DC and AC analysis capabilities of PowerGrid. PowerGrid DC adds advanced DC analysis capabilities such as voltage contour mapping, current hotspot highlighting and comprehensive AC analysis. Optimal’s common user interface, integrations and utilities make it extremely easy to use the tools together in a seamless design flow for simultaneous switching noise of designs up to 3GHz.

Optimal’s multi-gigahertz signal, power and SSN analysis solution, MGH SPI Suite includes PakSi-E for SSN analysis of designs up to 3 GHz, and integration of O-Wave and PowerGrid to deliver SSN analysis for high frequency signals.

Optimal’s PakSi-TM is a thermal-mechanical analysis solution that allows engineers to perform thermal modeling and analysis of effects such as thermal resistance and thermally induced stress. In addition it provides analysis of solder joint fatique, package warpage, and other mechanical stresses.

Optimal’s new SiP Thermal solution will provide thermal analysis for complex System-in-Package (SiP) designs.