Optimal is a leader in 3D power, signal and thermal integrity analysis for IC Package, System-in-Package (SiP) and PCB design. Our innovative co-design solutions enable design teams to concurrently analyze and optimize the IC together with the Package and the Packaged IC together with the PCB.
By providing the highest performance, best ease of use and pinpoint accuracy, our solutions allow engineers to create designs optimized for power and signal integrity in the shortest possible time. Through seamless integration with all of the major CAD design flows, Optimal solutions help customers achieve the shortest and most efficient overall design cycle time.
Optimal’s technology is embedded in the Cadence Allegro Platform and certified in the TSMC Reference Flow.
For more information, click on either your design type, solution requirement, or Optimal product name below or select from the menu on the left.
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