"We are impressed with the accuracy of the PakSi-E software. PakSi-E is a very fast simulator and is much faster than its competitors. PakS-Ei solves complex geometries much better than other tools we use. For example, a ground plane that has 100 bumps coming into it and 100 balls coming out of it can be solved in PakSi-E within 1-2 days, whereas with alternatives solvers, we were never able to get such a geometry to complete simulation and converge. PakSi-E never has any convergence issues!"

Ilya Gurevich, Assembly Process Development Engineer
Top-tier global semiconductor manufacturer
Santa Clara, California


"At Infineon, we always want to make sure we have the latest technology and to do our comparisons, we make sure to use the same model with a well-known setup. When we ran our test case with Optimal's O-Wave, our simulation run-time went from about 9 hours to under two hours, without sacrificing accuracy. This was simply amazing. "

Wolfram Eurskens, Manager "Simulation", Corporate Assembly & Test
Infineon Technologies AG
Munich, Germany

"We, at Agere, use Optimal’s PakSi-E software for complete package parasitic extraction of all designs including very high pin count. We’ve designated Pak-Si-E as our current tool in the design flow for full package parasitic extraction. Pak-Si-E’s output formats help us to provide package parasitics as a distributed SPICE netlist or IBIS model. Our greatest benefit is that PakSi-E makes it possible for us to examine several different design options quickly and efficiently"

Ramani Tatikola, Ph.D., Member of Technical Staff
Package and Interconnect Technology - Simulation and Performance
Agere Systems, Santa Clara, California


"We decided to purchase PakSi-E for three simple reasons. 1). the software's intuitive CAD interface capability allowed us to quickly convert package Gerber files (no matter how complex the package design was) into accurate 3-D models. 2). the software's ability to run RLC extraction on the entire package saved us time to work on other things. 3). the software's pinpoint accuracy gave us confidence in the data we presented to our customers. We have successfully matched PakSi-E's simulated data to actual TDR-measured data within +95% correlation. Add into the mix the company's history of top-notch customer support, we were immediately sold on the product."

Daniel Kim, Senior Electrical Characterization Package Engineer
Xilinx, Inc.
San Jose, California