Taiwan Semiconductor Manufacturing Company
Optimal is proud to be a key component in TSMC Reference Flow. Optimal contributed technology to TSMC’s Reference Flow that provide power and timing closure at the IC and package co-design phase. Together with other features of TSMC's Reference Flow 6.0, Optimal provides the foundry industry’s first integrated chip-and-package design methodology and play a key role in the foundry industry’s first power closure capability.
Cadence Design Systems
Allegro® system interconnect design platform from Cadence Design Systems, Inc. now have the additional advantage of world-class 3-D parasitic extraction. Optimal’s 3D field solver technology, found today in PakSi, will be embedded in Cadence’s Allegro Package SI 620 and Allegro Package Designer 620, giving designers the ability to extract signal interconnect for simulation or to characterize the entire IC Package as a simulation model. The integrated solution will include true 3D characterization of solder bumps, wire bonds and solder balls, as well as 3D modeling of complex ground and power planes.
Mentor Graphics
Mentor Graphics' OpenDoor program provides access to a diverse number of partner companies that offer well integrated, leading edge software solutions that complement the Mentor Graphics suite of tools in all aspects of the design process. Through OpenDoor, Mentor’s partners have agreed to develop and maintain commercial integrations, expanding the choices available to Mentor Graphics users in all design processes. Optimal’s Signal Integrity and Power Integrity solutions enable designers the ability to execute a more complete IC to Package to PCB design and verification flow.
Zuken
Zuken provides PCB and IC Package design solutions based on the CR-5000 suite. Optimal’s suite of products is integrated with CR-5000 to provide 3D signal, power and thermal integrity analysis of PCB designs created by CR5000 Board Designer and IC package designs created by CR5000 Package Synthesizer.
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