As smaller device geometries have increased IC functionality
and speed, it has become evident that the package is crucial
in determining IC reliability. Engineers know that reliability
depends on matching the thermal expansion properties of the
die, interconnects to avoid thermal differential expansion
due to internal or external temperature changes.
PakSi-TM™
allows package engineers to save time and money by determining
the thermal characteristics of the IC package before committing
the design to fabrication.
A list of features:
Thermal resistance
Popcorning
Interface delamination
Package warpage
Die cracking
Thermally induced stress
View Demo
Download
PakSi datasheet 
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