PowerGrid™ is a unique suite of DC and
AC power delivery tools for IR drop and
ground bounce analysis for IC packages and
printed circuit boards ( PCBs).
PowerGrid's
DC module computes voltage, current and
current density distributions in various structures. Arbitrary
groups of voltage and current sources can be assigned to solder
bumps, bond wires, solder balls and pin locations. Equivalent
SPICE netlists are also created with all
kinds of port assignments. Complex geometries of signal traces
and power/ground planes are modeled exactly and the built-in
graphical display helps engineers quickly identify the hot
spots in a package or PCB and the total currents through bond
wires, vias, solder balls, etc.
PowerGrid's
AC computes the S,Y,Z parameters in packages and PCBs. Arbitrary groups
of ports can be assigned to solder bumps, bond wires, solder
balls and pin locations. Decoupling capacitors
can also be specified at arbitrary locations. Complex geometries
of signal traces and power/ground planes
are accurately simulated over a wide bandwidth.
Optimal Full-Wave SI / PI Flow First to Offer Adjacent Structure Coupling 
Download
PowerGrid datasheet
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